2008/04/03 February 21, 2005: patent no. M257513 - a structure of chip stack package .

Patents of Chiplus.
February 21, 2005: patent no. M257513 - a structure of chip stack package
September 11, 2005 : patent no. M275536 - a kind of memory package (WSON)
November 1, 2005: patent no. I242873 - integrated circuit packaging method and structure for redistributing configuration thereof
December 21, 2006: patent no. M303585 - Method and structure for fabricating circuit board via wafer