News & Events
2008/04/03 February 21, 2005: patent no. M257513 - a structure of chip stack package .
Patents of Chiplus.
|February 21, 2005: patent no. M257513 - a structure of chip stack package|
|September 11, 2005 : patent no. M275536 - a kind of memory package (WSON)|
|November 1, 2005: patent no. I242873 - integrated circuit packaging method and structure for redistributing configuration thereof|
|December 21, 2006: patent no. M303585 - Method and structure for fabricating circuit board via wafer|